Whether you are replacing SMD components with external solder connections or other types of components such as SMT bases or PGAs , Weller provides you with the solution to your rework problems.

When it is necessary to remove SMD components from what is frequently a very expensive circuit board, the need to prevent damage to the board is the number one priority. Since the component targeted for rework is defective, consideration for damage to the component is secondary. Weller patented nozzle technology uses conducted heat from the integral hot plate in the nozzle to heat the component up to a temperature just below the melting point of the solder joint. Hot air is directed through precisely configured slots around the edges of the nozzle onto the legs of the component to finally melt the solder joint and allow removal of the component. By this means delamination of the board is effectively prevented.